Zulki's PCB Nuggets: Uncovering Assembly Problems of High-Speed PCBs

March 18, 2014
The high-speed board may be perfect when it comes to BGA assembly. All the balls properly collapse; all the thermal profiles are accurately determined and performed. All soak temperatures, pre-heat, soak, and cool-off periods fall within manufacturer limits and ranges. Yet, this high-speed board fails at high speed at the time of system functional level testing in the system.
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