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82 SMT007 MAGAZINE I JULY 2018 in continuous operation, it was replaced by a new model from the Series 300. Face-to-face assemblies are common, that is, assemblies in which BGAs are populated congruently on both the top and underside. Reliable quality control is only possible with 3D X-ray. Superpositions of BGA and SMD capacitors, likewise, pose a major challenge since they have a high density and complicate the evaluation of the X-ray images. However, layered reconstruction of the solder joints offered by X Line·3D provides reliable anal- ysis in a very short time. A 4-way panel of an assembly with multiple BGAs and a size of 216 mm x 164 mm, for example, needs on average just 26 seconds for the full 3D X-ray inspection. Software and Smart Operation It is not just adhering to cycle times that is important in production. A low level of programming complexity and simple opera- tion are valued in particular by contract manu- facturers with frequently changing assemblies with varying lot sizes. Thanks to a complete offline programming concept with the program- ming software PILOT AXI, test programs can be created and optimized remotely. A test proce- dure wizard guides the user through creating the program, from importing the CAD data to debugging the test program, helping with quick parametrisation of the test functions. The machine software PILOT Inspect makes handling the X-ray system even more conve- nient for the operator. The app-style touch- control operating concept clearly displays the most important information and allows even Figure 2: Andreas Türk from Goepel electronic (left) with Limtronik AOI/AXI technician Manuel Sehr at the X Line · 3D. Figure 3: Monitoring and controlling the X-ray system from a tablet.