FLEX007

Flex-July2018

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JULY 2018 I FLEX007 MAGAZINE 23 between the rigid and flexible areas of the design. The transition area is highly vulnerable to failure at the interface due to the naturally occurring stress concentrations which mani- fest there. The simplest solution is to provide a bead of polymer at the interface to move the stress point back from the edge (Figure 4). In the next, and final, installment of our series, "Designing Flex Circuits for First-Pass Success," we will wrap things up by address- ing a multitude of general concerns about flex and flex design. FLEX007 Visit I-007eBooks to download your copy of American Standard Circuits' micro eBooks today: • The Printed Circuit Designer's Guide to Flex and Rigid-Flex Fundamentals • The Printed Circuit Designer's Guide to Fundamentals of RF/Microwave PCBs Dave Lackey is vice president of business development at American Standard Circuits. Anaya Vardya is CEO of American Standard Circuits. Figure 4: Epoxy strain relief.

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