SMT007 Magazine

SMT-Aug2018

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Minimizes solder beading High ECM performance under low standoff components High print transfer efficiency with low variation Excellent wetting Very low bridging, slump, and solder balling Indium10.1HF Halogen-Free, No-Clean, Pb-Free S O L D E R P A S T E Click our video for more: Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/SMTUS ©2018 Indium Corporation Typical Voiding >40% Void Area Indium10.1HF <10% Void Area

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