Universal Finish SolderBond is an ENEPIG process using pure palladium.
It is already being used in the aerospace, aeronautic, satellite, mobile and
automotive industries. The process provides excellent reliability for solder
joints. Thanks to its extremely wide bonding process window it is the best
choice for wire bond applications.
Universal Finish SolderBond also guarantees the best corrosion protection.
Black pad failure, for instance, is completely eliminated.
Qualified for aerospace
and
satellite technology
www.atotech.com Global head office
Atotech Group
Rick Nichols
+49 30 34985 340
Rick.nichols@ atotech.com
Universal Finish SolderBond
ENEPIG fi nish for soldering,
gold, aluminum and
copper-wire bonding
Soldering Gold-wire wedge
100 µm
Aluminum-wire wedge
