PCB007 Magazine

PCB007-Aug2018

Issue link: http://iconnect007.uberflip.com/i/1011746

Contents of this Issue

Navigation

Page 9 of 95

10 PCB007 MAGAZINE I AUGUST 2018 protruding "tail" of zinc after desmear can be a potential cause of PTH failures. Read on to get the whole tale. Taking an overview approach, PNC's Sam San- gani provides a primer on reliability and quality in the PCB facility. He reviews critical areas or components to building a reliable product. And lastly, Tara Dunn, Omni PCB, enlight- ens us on Mina, an advanced surface treat- ment for soldering to aluminum. This may not sound like something for PCBs…or is it? As the various segments of electronics begin to con- verge towards ever-smaller features, more un- usual applications, and ever-more complicated thermal requirements, who is to say where this will fit into the PCB portfolio? At any rate, it is worth learning about. Next month we will be exploring another up- and-coming subject: mSAP and SLP. Or, modi- fied semi-additive processes and substrate-like PCBs. I'm still learning about these myself and looking forward to what our authors will reveal. See you then! Oh, yes… Subscribe! PCB007 Patricia Goldman is managing editor of PCB007 Magazine. To contact Goldman, click here. Next, Denny Fritz, recently retired from SAIC, brings a DoD perspective to the reliabil- ity discussion. He enlightens us on the work- ings within the defense community and the need for updated measures of reliability. Dovetailing with Fritz's article is an in-depth report by Happy Holden on the IPC High-Re- liability Forum for Mil-Aero and Automotive Sectors, held in Baltimore, Maryland in May. Several companies reviewed their testing of failed HDI microvias while other speakers dis- cussed the state of the PCB industry in the U.S. This is important information that Happy has brought back to our readers. Getting down to the nitty-gritty, Super Dry's Rick Heimsch provides practical and useful guidelines on bake-drying of PCBs based on the type of laminate. His information is based on the updated IPC guidelines and includes cautions regarding various final finishes. I-Connect007's old friend, Uyemura's George Milad, returns this month with his clear under- standing of the mechanism for nickel corrosion in deposits of the ENEPIG final finish, along with the best ways to prevent it and ensure a reliable final finish. Regular columnist Mike Carano, RBP Chem- ical Technology, brings us a cautionary "tale" relating to zinc treatment on copper foil, which enhances the copper-resin bond strength. The the ninth International Conference on Bridge Maintenance, Safety and Management. His presentation will include data on this trial bridge, a general assessment of the sensors used and his proposal for how to make structural health monitoring more routine in transportation infrastructure. Source: Sandia National Laboratories Photo: Mechanical engineer Stephen Neidigk positions a Com- parative Vacuum Monitoring sensor on a bridge. In his other hand is the con- trol system that periodically checks the sensor and a wireless transmitting de- vice to autonomously alert the mainte- nance engineers if it detects a crack. (Photo by Randy Montoya) Along with flying cars and instantaneous teleportation, smart bridges, roads and subway lines that can send out warnings when they're damaged are staples of futuristic transportation systems in science fiction. Sandia National Laboratories has worked with Structural Monitoring Systems PLC, a U.K.-based manufacturer of struc- tural health monitoring sensors, for over 15 years to turn this science fiction into science fact. They outfitted a U.S. bridge with a network of eight real-time sen - sors able to alert maintenance en- gineers when they detect a crack or when a crack reaches a length that re- quires repair. Sandia Senior Scientist Dennis Roach will present his team's work at Smarter, Safer Bridges with Sandia Sensors

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Aug2018