Design007 Magazine

Design007-Aug2018

Issue link: http://iconnect007.uberflip.com/i/1014812

Contents of this Issue

Navigation

Page 5 of 81

6 DESIGN007 MAGAZINE I AUGUST 2018 SHORTS: Amkor SmartPackage Speeds Accurate Design and Verification Quantum Chains in Graphene Nanoribbons Quick Memory New 3D-Printed Device Could Help Treat Spinal Cord Injuries Smart Homes Open New Approaches and Business Models for Healthcare Delivery EMA Expands Library with Power Integrations EDA and MCAD Models Free Webinar: Panelization with the Xpedition Flow Novel Approach to Coherent Control of a Three-Level Quantum System DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead ARTICLES: The Impact of PCB Dielectric Thickness on Signal Crosstalk by Chang Fei Yee Moving From 28 Gbps NRZ to 56 Gbps PAM-4: Is it a Free Lunch? by Yuriy Shlepnev COLUMNS: The Whole Package by Andy Shaughnessy It's a Material World by Barry Olney Transitioning from FR-4 to High-Frequency Materials, Revisited by John Coonrod Testing Time for Resins by Alistair Little HIGHLIGHTS: PCB007 MilAero007 Top 10 PCBDesign007 58 64 8 42 48 52 40 56 70 9 26 33 38 51 55 62 68 74 80 81 AUGUST 2018 • ADDITIONAL CONTENT 58

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design007-Aug2018