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Design007-Aug2018

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AUGUST 2018 I DESIGN007 MAGAZINE 71 5 Advanced Stackup Planning with Impedance, Delay and Loss Validation E A typical PCB design usually starts with the material selec- tion and stackup definition— the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget? 6 EMA Expands Library with Power Integrations EDA and MCAD Models E EMA Design Automation announced the avail- ability of symbols, footprints, and 3D models for all Power Integrations components, which anyone can access for free from ultralibrarian. com, power.com, and digikey.com. "With this new set of models, engineers can simply down - load the library components they need for their P ower Integrations based designs," said Manny Marcano, president and CEO of EMA. 7 Susy Webb: Training the New Generation of Designers E In this conference call with I-Connect007 Editors Happy Holden and Patty Goldman, I asked Susy to discuss the next generation of PCB designers, some of the trends she's see- ing among new PCB design- ers, and the need for designers to take charge of their own design training, whether their management agrees or not. 8 Irridian Invests in New Printed Circuit Board Design Software Suites E Recently acquired by Hindley Circuits, Irridian Industrial Electronics, has invested in intro- ducing state-of-the-art PCB design software to significantly enhance the accuracy and speed of its design services. The new Zuken CAD- STAR and Altium design software platforms have modern and interactive user interfaces. 9 Achieving Optimum Signal Integrity During Layer Transition on High-Speed PCBs E This article discusses the impact of stitching vias and discontinued return path or reference on signal integ- rity during layer transition on high-speed PCBs, par- ticularly in terms of signal reflection and crosstalk. J Cadence Sigrity 2018 Release Accelerates PCB Design Cycles E Cadence Design Systems has launched Cadence Sig- rity 2018, which includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance. A unique, 3D design and 3D analysis environment integrating Sigrity tools with Cadence Allegro technology provides a more efficient and less error-prone solution than current alternatives utilizing third-party modeling tools. PCBDesign007.com for the latest circuit design news and information—anywhere, anytime.

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