PCB007 Magazine

PCB007-Sept2018

Issue link: http://iconnect007.uberflip.com/i/1024460

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T H P -1 0 0 ( N E W V E R S I O N ) Short Curing Time Low CTE for Better Back Drilling T H P -1 0 0 DX 1 (G F ) G A P F I L L I N G M AT E R I A L Low Warpage Easy to Process T H P -1 0 0 DX 1 V F ( H V ) Excellent Filling Characteristics for Large Holes 100% Solids, Low Shrinkage THP-100 DX1 VF (HV) T H P -1 0 0 DX 1 H TG Highest TG (173°C) Available on the Market Low CTE (19/55) THP-100 DX1 (HTG) THP-100 DX1 (GF) Phone [775] 885-9959 • www.taiyo-america.com • info@taiyo-america.com F I L L I N G Y O U R C H A L L E N G E S O N E V I A AT A T I M E

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