Issue link: https://iconnect007.uberflip.com/i/1024460
42 PCB007 MAGAZINE I SEPTEMBER 2018 Beaulieu: What are your plans? Where, for ex- ample do you want to be in five years? Rathburn: The short answer is five years away seems too far away to predict. The drive for sil- icon node shrinks appears to be more challeng- ing and yield curves difficult to manage. When I look at toda y's state-of-the-art electronics, there are extremely complex silicon devices sur - rounded by hundreds of less complex devices and connected with large connectors. We have many patents, applications and disclosures re - lated to high-speed interconnects that can not only improve the performance and shrink the PCB, but also the internal connectors and inter - faces to the outside world. The elegant integra- tion of these complex interconnects in a high- speed way is my personal interest. The plan driven by reality today is to support the produc - tion ramp, work with customers to design their version of the technology and push the capabil- ity to the next node in 2019. Beaulieu: What new products are your work- ing on? Rathburn: We are currently investing in two parallel paths. The first is engineering and ap- plications support for Benchmark custom- ers as the technology matures and is adopted into production. Benchmark has made signif- icant investments in the launch technologies that will be available in production soon, but the engineering expertise to help the customers imple- ment is a key future invest- ment with software, simula- tion, high-speed and RF de- sign rules, and practical ap- plication support. The second investment is to extend the launch ca- pability to the next process node with a key focus on not just the circuit fabrica- tion, but the unique assem- bly techniques needed to in- tegrate function and devic- es into the LCP circuit stack. Shrinking from 20- or 25-micron circuit fabri- cation down to nine microns does not seem like a big shrink, but below 20 microns there is a significant process and capability shift that is not trivial. Beaulieu: When will they be coming out? Rathburn: The launch capabilities are in sam- ple and qualification stages through 2018, and 2019 will bring the next technology node. Beaulieu: Any last comments as we wrap up this interview? Rathburn: In closing, HSIO is very proud to be in a position to enable our exciting tech- nologies with Benchmark as our manufactur- ing partner, and our customers as our devel- opment partners. There is no other compa- ny, collaboration or technology I am aware of that can design, build and assemble a high lay- er count, high-density, high-speed LCP-based printed circuit with the ability to directly at- tach die or embed devices that normally func- tion discretely. We are also very proud to be a foundational part of Benchmark's new RF High-Speed Center of Innovation and believe our vision and technologies are fulfilled in a way that makes Benchmark the new measure in the EMS industry. Beaulieu: Thanks, Jim. PCB007 Figure 5: Benchmark's RF High-Speed Design Center, circuit fab, and assembly operations.