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Design007-Sept2018

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74 DESIGN007 MAGAZINE I SEPTEMBER 2018 1 Mentor Preparing for Next-Gen PCB Designers E In this interview, Paul Musto, director of mar- keting for Mentor's Board Systems Division, explains the company's initiatives aimed at drawing more students into PCB design. We also discussed the recent movement of elec - trical engineers into PCB layout, the need for students seeking to become PCB designers, and some of the ways that young people are already beginning to revolutionize this industry. 2 Polar Instruments Releases Updates on Speedstack Tool E Polar Instruments released detailed informa- tion documenting recent changes and improve- ments to their Speedstack tool for rigid PCB layer stackup design and documentation. Polar Instruments claims that Speedstack PCB stackup design tool slashes stack creation time to a frac - tion of that taken by traditional methods, reduc- ing the chances of miscommunication with PCB manufacturers and the supply chain. 3 Pulsonix Version 10.0 Features 3D PCB Design E The latest release of Pulsonix expands its prod- uct portfolio with intelligent interactive edit- ing within the 3D design environment. By enabling the co-design of the PCB within the 2D PCB and 3D environments, Pulsonix short- ens the time to market with a more productive workflow and reduces costly errors. 4 Chuck Bauer Discusses the Future of Packaging E When we decided to cover the future of PCB packaging, we knew we would have to inter- view Charles Bauer, Ph.D., owner of TechLead Corpora- tion. Chuck recently spoke with Happy Holden, Andy Shaughnessy and Barry Matties about current trends in packag- ing, the need for product designers and manu- facturers to communicate, and why no matter how cool the technology is, cost is still king. Recent Highlights from Design007

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