Design007 Magazine

56 DESIGN007 MAGAZINE I SEPTEMBER 2018 Figure 18: Cylindrical (JEDEC TO). Figure 19: Single In-line Package (SIP) & Dual In-Line Package (DIP). Figure 20: Header, Vertical (HDR).

• Cover
• Featured Content — Artificial Intelligence
• Additional Content
• Column — AI at the Crossroads
• Short — Enabling 'Internet of Photonic Things' With Miniature Sensors
• Feature — Artificial Intelligence: More Questions than Answers
• Feature Interview — Cadence: Bullish on AI
• Feature Interview — Artificial Intelligence: The Future of EDA?
• PCB007 Highlights
• Column — 10 Fundamental Rules of High-Speed PCB Design, Part 1
• Column — Embedding Components, Part 3: Implementing Discrete Passive Devices
• Column — Contract Positions: Go the Extra Mile
• MilAero007 Highlights
• Article — Standard PCB Component Families, Part 2
• Short — Bismuth Shows Novel Conducting Properties
• Article — Achieving Minimal Crosstalk in Multi-Board Interconnect
• Short — Diamond Dust Enables Low-Cost, High-Efficiency Magnetic Field Detection
• Article — Life Beyond 10 Gbps: Localize or Fail!
• Top 10 Recent Highlights from Design007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead