SMT007 Magazine

SMT007-Oct2018

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6 SMT007 MAGAZINE I OCTOBER 2018 SHORTS: Mycronic Discusses Industry 4.0 Rehm Sees Growing Demand for Vacuum Soldering The Hermes Standard Becomes IPC-HERMES-9852 Study Demonstrates New Mechanism for Developing Electronic Devices KAIST Develops VRFB with Longer Durability Photonic Chips Harness Sound Waves to Speed Up Local Networks Using Donut-shaped Lithium Sulfide for Higher Performing Batteries ARTICLE: Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications by Ranjit Pandher, Matthew Siebenhuhner, Gyan Dutt, Mitch Holtzer, T.W. Mok, Amit Patel COLUMNS: CFX: The Data Train is Now 'Boarding' by Nolan Johnson Do's and Don'ts of Thermal Management Materials by Jade Bridges HIGHLIGHTS: MilAero007 Supply Line Markets Top Ten from SMT007.com DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead 68 8 62 24 36 48 84 87 94 95 10 34 46 54 60 66 82 OCTOBER 2018 • ADDITIONAL CONTENT 68

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