Issue link: https://iconnect007.uberflip.com/i/1038326
OCTOBER 2018 I PCB007 MAGAZINE 39 1:10.000. In the case of horizontal systems, triple or quadruple rinses equipped with ad- vanced fluid devices must be used to achieve a proper solution exchange in drilled holes and on the panel surfaces. The concept at GreenSource with conduc- tivity controlled high-flow concentrate rinses, combined with pH and conductivity controlled triple rinses, helps achieve these targets. By us- ing a simple rinsing concept, this can only be achieved by using plenty of water. For plating, we installed our Uniplate advanced IP2 platers, which are considered leading-edge in Asian markets. Today, we look at hundreds of instal- lations worldwide. The installations at Green- Source are the first advanced IP2 platers in the Americas. Matties: What else is new? Moody Dreiza: GreenSource is the first custom- er to use different chemistries for one plater, meaning that we fill the plater, use it for pro- duction, pump the solution back to the hold- ing tank, and then come back with a new solu- tion to make the same line suitable for another product and process. That is a unique setting in the market today, and it was a great achieve- ment for us to engineer and provide a system set offering this high degree of process flexibil- ity to one of our customers. Matties: John, you are the account manager. Could you explain all the Atotech equipment installed by the exact production sequence here at GreenSource? John Foley: We have several different systems, from inner layer, all the way through what we consider to be outer layer. We have multiple versions of our BondFilm products, featuring our alternative oxide process. One line is the high copper load, which is the first in the U.S. of this type, and the other is a BondFilm LDD SR, which is a flash reducer after laser drill- ing. For desmear, which is the third system we have there, we run our Securiganth P chemis- try. Happy Holden: Do you execute an alternative oxide before lamination for the inner layer? Foley: Yes, we do. We count several BondFilm products for that process step. Our product series is world renowned for low edge depth <1µm, high copper holding capacity, and ex- cellent signal integrity due to lower surface roughing. Holden: What is the next process step in the line? Foley: We have two different electroless cop- per lines at GreenSource. One line is designed for thicker pan- els (the standalone electroless line), and the other line is de- signed for thinner panels (the LBCu6 line). Each uses a dif- ferent conveyor system, but the chemistry is the same in both— all horizontal. Schmidt: For example, our UTS- xs concept is designed to pro- cess panels of 40 microns in thickness including 2 x 2 mi- crons of copper clad, which I would consider to be very thin and flexible material. Our fluid management is also key. It en- Figure 3: The Atotech Uniplate IP2 at GreenSource Fabrication.