Design007 Magazine

Design007-Oct2018

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6 DESIGN007 MAGAZINE I OCTOBER 2018 SHORTS: New Half-Light Half-Matter Particles May Hold the Key to a Computing Revolution Medication You Can Wear Superconducting at the Speed of Light Novel Topological Insulator New NIST Method Measures 3D Polymer Processing Precisely HIGHLIGHTS: PCB007 MilAero007 Top 10 PCBDesign007 DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead ARTICLES: New Designers Council Column: The Digital Layout Interview with Mike Creeden and Steph Chavez Impact of Serpentine Routing on Multi-gigabit Signal Transmission by Chang Fei Yee COLUMNS: Despite Progress, Design Data Issues Continue by Andy Shaughnessy New Landing Design to Reduce Thermal Pad Failures by Bob Tise and Dave Baker 10 Fundamental Rules of High-Speed PCB Design, Part 2 by Barry Olney Embedding Components, Part 4: Passive Component Selection and Land Pattern Development by Vern Solberg Different Aspects of Impedance for PCBs by John Coonrod 66 70 8 42 46 52 60 9 16 23 29 51 40 64 78 81 88 89 OCTOBER 2018 • ADDITIONAL CONTENT 66 Cu thickness Dk Conductor width Substrate thickness

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