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OCTOBER 2018 I FLEX007 MAGAZINE 29 rate flexible layers of the design. It is a funda- mental compounding of the challenge described earlier and as such it requires even more atten- tion to detail and even more consultations with engineering staff because the process planning can be quite complex. See Figure 6. We hope you have found our three-part series "Designing Flex Circuits for First-Pass Success" both enjoyable and educational; it was intended to help flex PCB designers con- sider the many issues that can impact the PCB fabricator and product reliability. Look for more flex PCB articles from us in the upcom- ing issues of Flex007 Magazine. FLEX007 Visit I-007eBooks to download your copy of American Standard Circuits' micro eBooks today: • The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals • The Printed Circuit Designer's Guide to... Fundamentals of RF/Microwave PCBs Dave Lackey is vice president of business development at American Standard Circuits. Anaya Vardya is CEO of American Standard Circuits. Figure 6: 10-layer rigid-flex with multiple layer separation and discrete routes. of the semiconductor that the ANU team developed. The inorganic component has the thickness of two atoms. The hybrid structure can convert electricity into light for dis- plays on mobile phones, televisions and other electronic devices. "We have the potential with this semiconductor to make mobile phones as powerful as today's supercom- puters," said Mr Sharma from the ANU Research School of Engineering. (Source: Australian National University) Engineers at ANU have invented a semiconductor with organic and inorganic materials that can convert elec- tricity into light very efficiently, and it is thin and flexible enough to help make devices such as mobile phones bendable. It also opens the door to a new generation of high-performance electronic devices made with organic materials that will be biodegradable or that can be easily recycled. The organic component has the thickness of just one atom—made from carbon and hydrogen—and forms part Part-Organic Invention Can Be Used in Bendable Mobile Phones