PCB007 Magazine

PCB007-Nov2018

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Etching effect as received Etching effect POR atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com BondFilm ® HF Enhanced performance Bonding enhancement solu ons for low signal loss with high frequency applica ons Etching effect with BondFilm ® HF For high frequency applications there is a demand for a bonding enhancement process that gives the same excellent thermal reliability of the BondFilm ® product range, but with superior performance in terms of reduced signal loss compared with the standard solutions available. BondFilm ® HF is a cost effective drop in replacement for conventional bonding enhancement solutions, offering enhanced performance with high frequency applications without the need to revert to more complex NEAP applications.

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