PCB007 Magazine


Issue link: http://iconnect007.uberflip.com/i/1060280

Contents of this Issue


Page 4 of 121

atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Inpulse ® 2THF Void free through hole filling Through via filling for IC/CSP substrate 100 μm 200 µm 120 µm 100 μm Dramatically reduced costs compared to conventional plugging technology Laser drilled through hole with 15 µm plated copper THF: only 16 µm plated copper on surface including foil copper The Inpulse ® 2THF electrolyte together with the unique Uniplate ® InPulse 2 system is ideally suited for through hole filling especially for core material with copper foil thickness less than 5 μm. The process provides excellent surface uniformity with minimum surface plated copper. Inpulse ® 2THF enables the option to run through hole metallization and electrolytic copper THF in one conveyorized process line. Patented Bridge Pla ng Technology

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Dec2018