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atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Inpulse ® 2THF Void free through hole filling Through via filling for IC/CSP substrate 100 μm 200 µm 120 µm 100 μm Dramatically reduced costs compared to conventional plugging technology Laser drilled through hole with 15 µm plated copper THF: only 16 µm plated copper on surface including foil copper The Inpulse ® 2THF electrolyte together with the unique Uniplate ® InPulse 2 system is ideally suited for through hole filling especially for core material with copper foil thickness less than 5 μm. The process provides excellent surface uniformity with minimum surface plated copper. Inpulse ® 2THF enables the option to run through hole metallization and electrolytic copper THF in one conveyorized process line. Patented Bridge Pla ng Technology