Design007 Magazine

Design007-Dec2018

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74 DESIGN007 MAGAZINE I DECEMBER 2018 MilAero007 Highlights Increasing Productivity for Flex Fabricators E Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators' throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market. Ventec at electronica 2018: No Compromises for High-frequency Materials E Ventec's IMS material families, thermally con- ductive and standard laminates and prepregs for multilayer PCB's, Ventec has teamed up with EMI Thermal to provide a range of thermal inter- face materials (TIM) to the European market. ERAPSCO Inks $40M in Navy Sonobuoy Contracts E Ultra Electronics Holdings plc (ULE) and Sparton Corporation announce the award of subcontracts valued at $39.6 million to their ERAPSCO joint venture, for the manufacture of sonobuoys for the United States Navy. Nano Dimension Partners with Productivity Inc., Expands Reseller Network E Nano Dimension announced a new reseller agreement with Productivity Inc., significantly expanding the company's North American channel partner ecosystem. Sparton Receives 2018 Asia Pacific Entrepreneurship Award E Dung Tran, managing director of Spartonics Viet Nam Co. Ltd, has been presented with the 2018 Asia Pacific Entrepreneurship Award for exemplary leadership and innovation in the electrical and electronics industry. Rick Hartley is Bullish on PCB Design, 3D Printing E At the recent PCB West in Silicon Valley, Con- sulting Technical Editor Tim Haag met with long-time design industry veteran Rick Hart- ley to discuss the changing landscape of cir- cuit board design, the layout designers of the future, and how designers can benefit from 3D printing of circuit boards. Substrates for Advanced PCB Technologies: What Will the Future Hold? E The UK chapter of the global IMAPS commu- nity of electronics and microelectronic packag- ing engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November. Standard of Excellence: Forging Partnerships Through Adversity and Problem Solving E For the past few months, this column has discussed how to find and work with a great PCB vendor, and most importantly, how to form a strong, productive partnership. This month, Anaya Vardya will address how adversity can forge a great partnership between you and your PCB vendor that will last for life. NASA Looking to Tiny Technology for Big Payoffs E NASA is advancing technology that could use large amounts of nanoscale materials to launch lighter rockets and spacecraft than ever before. The super-lightweight aerospace composites (SAC) project seeks to scale up the manufac- turing and use of high-strength carbon nano- tube composite materials.

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