PCB007 Magazine

PCB007-Jan2019

Issue link: https://iconnect007.uberflip.com/i/1069358

Contents of this Issue

Navigation

Page 41 of 105

42 PCB007 MAGAZINE I JANUARY 2019 Interview by Happy Holden I-CONNECT007 Happy Holden recently spoke with Roger Bernards, product development R&D manager at MacDermid Alpha Electronics Solutions, at SMTA International about molded interconnect devices (MIDs) and a new additive electroless copper bath related to the automotive industry. Happy Holden: Roger, can you tell us a little about the plating of plastic MIDs for automotive applications? Roger Bernards: The MID process involves laser ablation of a 3D plastic substrate to draw the pattern of the circuit and the metallization of this pattern with an electroless copper solution. There is no electroplating on the parts due to its structure and isolated circuitry. The typical deposit from an electroless copper bath is quite stressed and prone to cracking when subjected to physical or thermal shock. The automotive space has been reluctant to adapt MIDs for certain applications into their automobiles because of reliability concerns. What's needed is an electroless copper bath that can withstand the stresses of applications with the environmental extremes that you would experience in the automotive industry. MacDermid Alpha has formulated a new additive electroless copper bath that produces a deposit with zero internal stress and a very high percentage of elongation on the order of over 12%. We feel that this new technology enables the automotive industry to utilize MID technology for things like sensors, headlight displays, or under-the-dashboard components. The new formulation has the proper physical properties that you would need for these types of environments that might be utilized in the automotive space. It is quite exciting. Holden: Walk us through the process of manufacturing an MID. How's that different from conventional electronic applications? Bernards: The plastic used to form the MID has an embedded catalyst. The circuitry pattern is directly lasered onto the plastic. The catalyst concentrates onto that lasered print, and provides a location for the initiation of the

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-Jan2019