PCB007 Magazine

PCB007-Jan2019

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72 PCB007 MAGAZINE I JANUARY 2019 The process flow for Lean manufacturing, automation, and CAD and CAM has cut the processing time for multilayers down to just two days from the typical three to four weeks. It has also cut the lot size to just one panel, down from the typical high-volume lot size of 200 to 1,000 panels. This gives GreenSource the flexibility to do prototype runs mixed with very high-volume production runs even when the product mix may include multilayer, HDI, two-sided, and metal- backed thermal boards. Different final finishes do not affect throughput or turnaround time. The CAD and CAM automation utilize direct imaging in several new innovative processes such as direct digital imaging (DDI) of pattern- or panel-plating resist and etch resist, as well as inkjet printing of solder mask and legends. For fine-line and high-density circuits, digital-direct-exposure is used, which eliminates all artwork, inspection, handling, and storage. Lower Costs by Eliminating Waste Lean does not need to be limited to manufacturing alone. Lean is a principle that can apply to all our goods and services. The green strategy has six major systems: 1. Water use minimization in processes by innovative rinsing 2. Processes that accept volume make-up from capture rinses 3. Hermetically sealed equipment to eliminate venting 4. Venting processes locally with recycled DI water 5. Continuous chemical analysis and dosing to minimize concentrations and maximize controls 6. Chemical regeneration with make-up from rinse water concentrations Table 1 details only part of fifteen innova- tions that contribute to the waste and water Table 1: Fifteen specific cost reduction actions (Lean) and their impact (green).

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