86 DESIGN007 MAGAZINE I JANUARY 2019
1
Beyond Design: 10 Fundamental
Rules of High-speed PCB Design,
Part 3
E
Planes are essential in today's
high-speed multilayer PCBs.
Unfortunately, the number
of power supplies required is
increasing dramatically with IC
complexity. Now, accounting
for them all has become a real
challenge. The high number of supplies generally
leads to higher layer count substrates.
2
Mentor Discusses New DFT, DFM,
and Design Verification Tools
E
At electronica 2018, John McMillan, digital
marketing program manager-Electronic Board
Systems, and Mark Laing, business develop-
ment manager-Valor Division of Mentor, a
Siemens business, discuss new tools for PCB
design verification, as well as design for
manufacturing (DFM) and design for testing
(DFT).
3
Top 10 Most-read Design007
News of 2018
E
Every year, we like to take a look back at the
most popular PCB design news and articles.
These are the top 10 most-read PCB design
news items from the past year. Check them out.
4
Quiet Power: Measurement-to-
simulation Correlation on Thin
Laminate Test Boards
E
A year ago, I introduced causal and frequency-
dependent simulation program with integrated
circuit emphasis (SPICE) grid models for
simulating power-ground plane impedance. The
idea behind the solution was to calculate the
actual R, L, G, and C parameters for each of the
plane segments separately at every frequency
point, run a single-point AC simulation, and
then stitch the data together to get the frequency-
dependent AC response. This month, I will
demonstrate how that simple model correlates
to measured data and simulation results from
other tools.
Editor Picks from PCBDesign007
Barry Olney
