FLEX007

Flex007-Jan2019

Issue link: https://iconnect007.uberflip.com/i/1073397

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Challenges in flex circuitry require that all materials are designed to work together. For the first time, a single source has your solution. www.macdermidalpha.com INTRODUCING... Low stress copper metallization • Solderable final finishes • Low temp solders Flex-compatible oxide alternatives • Encapsulant & attachment materials Semiconductor advanced packaging CIRCUITRY SOLUTIONS SEMICONDUCTOR SOLUTIONS ASSEMBLY SOLUTIONS EXPERTISE CO-DESIGN SERVICE Industry experts working side-by-side Products created to optimize all material interfaces Solving problems with an industry-wide perspective

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