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JANUARY 2019 I FLEX007 MAGAZINE 41 Ventec Expands ThinFlex Inventory in Europe E Ventec International Group Co., Ltd. is expand- ing its ThinFlex inventory to multiple Euro- pean locations with full cutting capability in both Germany and the UK. All Flex Expands Rigid-Flex Capabilities with Pluritec X-ray Drill/Rout Optimizer E All Flex purchases new Pluritec Inspecta HPL X-Ray Drill/Rout Optimizer & two EVO-2S Automated drill/rout systems to expand rigid- flex capabilities. IPC Executive Forum on Advancing Automotive Electronics E The forum features such worldwide notables as Dr. Udo Welzel, team leader of automotive electronics, engineering assembly and inter- connect technology at Robert Bosch GmbH, who will present "Enabling Connected, Elec- trified and Automated Mobility: Challenges for Assembly and Interconnect Technology." Nano Dimension Partners with Productivity Inc.; Expands Reseller Network E Nano Dimension announced a new reseller agreement with Productivity Inc., significantly expanding the company's North American channel partner ecosystem. Flexible Electronics Market to Witness Enhanced Application E The global flexible electronics Market is esti- mated to touch $87.21 billion by the comple- tion of the prediction period. It is estimated to develop at a substantial CAGR for the duration of the prediction. FLEX 2019 and MSTC to Highlight MedTech, Transpo and IoT E Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co- located FLEX 2019 and MEMS & Sensors Tech- nical Congress (MSTC) in Monterey, Califor- nia, February 18-21, 2019. Amphenol Invotec Reaffirms Status as an ESA-Approved Supplier E Amphenol Invotec, a leading European man- ufacturer of advanced PCBs, is pleased to announce that it has successfully extended its European Space Agency (ESA) qualification for the supply of sequential rigid polyimide boards to November 2020. IDTechEx Highlights World Firsts in Printed Electronics in 2018 E With the end of the year in sight, it's interest- ing to look back and review what has been new in the world of printed electronics in the last 12 months. This analysis is taken from the new IDTechEx Research report, "Flexible, Printed and Organic Electronics 2019-2029" covering the entire sector in great detail, based on analyzing the industry for over 15 years. Challenges in Flex Circuit Assembly E In a recent I-Connect007 survey on flex cir- cuits, we asked the following question: What are some of the challenges that you face uti- lizing flex circuits? Here are just a few of the replies, edited slightly for clarity.

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