PCB007 Magazine

PCB007-Feb2019

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atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Cupracid ® VF BMV filling for ver cal systems with soluble anodes Inclusion-free BMV filling (dimple <5 µm) at 25 µm >70% throwing power for TH with AR 8:1 Cupracid ® VF is a BMV filling process for use in vertical plating systems with soluble anodes. It can be used with air and sparger agitation and is compatible with VCP and hoist type systems. The process consist of two additives which may be analyzed using CVS analysis for simple maintenance and process control. A pre-dip additive is added to the acid dip right before the plating tank for optimal filling results. 10 μm 75 μm 1.7 μm 150 μm BMV Filling Soluble anode process CupraPro ® S8 Acid Cleaner Rinse Minimum 2 stage rinse Securiganth ® C Etch cleaner Rinse Minimum 2 stage rinse Cupracid ® VF Copper BMV filling Cupracid ® VF Pre-Dip Acid Dip

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