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MacuSpec VF-TH 200 Simultaneous Through Hole Plating and Via Filling Copper Metallization MacDermid Enthone's MacuSpec VF-TH 200 is the metallization process to choose when efficiency, reliability and cost savings are the goal. Developed from patented technologies and in-depth technical experience, VF-TH 200 is capable of simultaneously filling vias and plating through holes with electrolytic copper that has great physical properties and a wide range of structure sizes. Beyond the increased performance, VF-TH 200 boasts savings in cycle time, processing costs and increased reliability. macdermidenthone.com/electronics MacuSpec VF-TH 200 can fill 3x3 mil to 5x3 mil vias in less than 60 minutes with optimal physical properties and structural attributes. VF-TH 200 passes IPC 6012D, DS, DA and 6013D. More than 276 MPa [40,000 PSI], and greater than 18% elongation. Break Force (N) Elongation (%) Tensile Strength (MPa) Approx. Thickness (microns) 1 279 19.68 295 79 2 276 22.42 306 75 3 265 19.67 274 81 4 270 18.67 296 76 5 272 21.72 307 74 6 257 21.91 287 75 7 259 20.14 286 75 8 279 18.94 303 77 9 271 18.83 288 78 10 252 20.73 268 78 Mean 268 20.28 291 77 electronics.macdermidenthone.com macdermidalpha.com