Design007 Magazine

Design007-Apr2019

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6 DESIGN007 MAGAZINE I APRIL 2019 SHORTS: Tiny Silicon Nanoparticles Cement New Era for Ultra-high Capacity Batteries Photonics Breakthrough: Device That Shakes Light Researchers Report Advances in Stretchable Rubery Semiconductors, Integrated Electronics New Graphene-based Device Paves the Way for Ultrasensitive Biosensors DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead ARTICLE: EM Modeling: The Impact of Copper Ground Pour on Loss and Impedance by Chang Fei Yee COLUMNS: Get Smart! by Andy Shaughnessy San Diego Chapter Updates and More by Stephen Chavez Preparing for Tomorrow's Technology Today by Bob Tise Five Tips to Further Improve Resin Encapsulant Performance by Alistair Little Fast and Accurate Transmission Line Modeling by Barry Olney How Copper Properties Impact PCB RF and High-speed Digital Performance by John Coonrod HIGHLIGHTS: PCB007 MilAero007 Top 10 PCBDesign007 66 8 36 42 48 52 60 34 64 72 14 22 51 70 75 84 85 APRIL 2019 • ADDITIONAL CONTENT 36 66

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