PCB007 Magazine

High Technology Imaging in a Large Format System MIVA: LED DIRECT IMAGING - Large Format MivaTek Global, 6 Dickinson Drive, Suite 215, Chadds Ford, PA 19317 Contact: Brendan F. Hogan, M (610) 620-3795, B.Hogan@MivaTek.Global Chris Hrusovsky, M (612) 205-6113, Chris@MivaTek.Global Website: www.MivaTek.Global ► PCB Inner Layer ► PCB Outer Layer ► Solder Mask ► Glass Emulsion ► Reel to Reel ► Silver Film Miva 3000 L Globally marketed and serviced Applications ► 30" x 60" Standard Imaging Area ► Up to 3 light engines ► 1 mil registration accuracy ► Small footprint for the imaging area ► 10, 25 and 50µ feature systems available ► Images all materials resist and soldermask ► A/B Registration: 1 mil over entire area ► Large Panel Size: up to 762mm x 1524mm Features

• PCB007 Magazine April 2019
• Featured Content — New Talent in the PCB Industry
• Additional Content
• Column — Youth in the Industry—Reaching New Heights
• Feature — MakeHarvard: A Glimpse of Technology to Come
• Feature Interviews — University Students Point to the Future in Their Research
• Short — Researchers Discover New Material to Help Power Electronics
• Feature Column — Calling All Scholars and Educators: IPCEF Launches Scholarship Program
• Short — Creating Better Solar Cells
• Short — George Fox University: Teaching PCB Design to EE Students
• Feature Interview — SEMI's Cristina Sandoval on Mentoring and Retaining Young Talent
• Supplier Highlights
• Feature Column — New Engineering Talent Joining the Electronics Industry
• Short — Tiny Waveguides Could Enable Better Biomedical Devices, Wearable Displays
• Feature — Engaging the Future of Advanced Manufacturing: NextFlex and DuPont in Silicon Valley and Beyond
• Electronics Industry News and Market Highlights
• Feature Column — Merging the Best of Both Worlds: Young Superheros and Knowledgeable Wizards!
• MilAero007 Highlights
• Interview — Averatek on the Future of Additive and Semi-additive Processing
• Article — Electrolytic Plating: Filling Vias and Through-holes
• Column — OSP Performance: Effect of Film Thickness and Microetch
• Short — Agfa on Revolutionary Inkjet Solder Mask Applications
• Article — Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination
• Short — Atomic-scale Binary Logic Could Power Faster, More Energy-efficient Electronics
• Top 10 Editor Picks from PCB007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Info.