Issue link: https://iconnect007.uberflip.com/i/1104607
92 PCB007 MAGAZINE I APRIL 2019 top and bottom sides. Again, this is without the need for sequential lamination. Note that the traditional double-blind via construction uses three lamination cycles: two for the half product and the third to laminate both half products together. In contrast, Next- GIn's process at this point in fabrication has used only a single lamination cycle. Building the Vias Next in the process is buried via construc- tion, using microvias on both sides of the bur- ied via. The microvia can be placed on top or next to the buried via. Placing it on top re- quires an additional plating cycle. The microvia constructions in Figures 5 and 6 can be replaced by a single lamination cycle using VeCS-2 (blind slot) as shown in Figure 7. The routing and power plane density can be increased using VeCS-2. This will yield a lower cost price for the same product as the layer count can be decreased as well. Using VeCS-2 delivers two-side component placement capabilities similar to conventional Figure 6: Traditional microvia constructions that can be replaced by VeCS. Figure 7: Single-lamination VeCS with a blind slot. Figure 8: Two-sided component placement using VeCS.