Issue link: https://iconnect007.uberflip.com/i/1116895
4 PCB007 MAGAZINE I MAY 2019 MAY 2019 • FEATURED CONTENT How do current materials stack up? We find out. First, we lay down some high-level perspective on materials, megatrends in materials, and economic forces at play in the market. Then, we layer in specifics with materials manufac- turers in this our materials issue. The Materials Issue Alun Morgan on the Future of PCB Materials Interview with Alun Morgan Making Materials Succeed: Past, Present, and Future Trends Interview with Tony Senese DuPont on Materials Challenges and New Opportunities Interview with John Andresakis and Jonathan Weldon Insulectro's OEM Program: Time to ACT! Interview with Ken Parent Laminate Suppliers Face Increasing Demands From Customers Interview with Alan Cochrane Isola on Adapting Processes to Meet Customer Needs Interview with Sean Mirshafiei Creating Stability in Materials Chaos Interview with Tony Senese FEATURE COLUMN: New Materials or New to You? by Tara Dunn 10 28 38 54 64 72 86 24 10 28 38