PCB007 Magazine


Issue link: http://iconnect007.uberflip.com/i/1116895

Contents of this Issue


Page 67 of 131

68 PCB007 MAGAZINE I MAY 2019 when selecting a material for newer RF-based, higher-density applications. Engineers are in- creasingly being required to look for appro- priate materials for these designs; FR-4 just doesn't cut it. You have all of these materials that you're working on. How best should a de- sign team become knowledgeable with TUC's products? And how do OEMs analyze your portfolio and zero in on what they need? Cochrane: We spend a lot of time giving semi- nars to our customers all over the world. Ini- tially, we focus at the OEM level. It's a give- and-take situation where they reach out to us with a problem, and we need to try to find a solution for it. Sometimes, their current supply base might not be meeting their needs. We do our best to give a detailed presentation for any industry and show all of the testing that we do. We do a ton of testing with different thick- nesses and dielectrics with three-ply construc- tions versus single-ply constructions. Because TUC has the benefit of having a large mass lamination facility in our Taiwan factory, we can build test samples, then test them all and get proper results to share. Still, face-to-face meetings are the best way to go. Johnson: You're finding that you definitely want to meet in person with the design team. Cochrane: That's when the questions that come up. When we put together a detailed, high-level presentation from an engineering standpoint, Mass lamination process at TUC.

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-May2019