Issue link: https://iconnect007.uberflip.com/i/1116895
MAY 2019 I PCB007 MAGAZINE 99 performance class continuity requirement. Along comes multiple voltage requirements within the same board, HiPot requirements, and in many cases, time domain reflectome- try (TDR.) Again, ET needs to supply all these services as efficiently and cost-effectively as possible, which is why finding the right equip- ment solution is imperative. Test requirements continue to change as the designs advance. When searching for the right solution, gauge your requirements against the deliverables of the equipment. The advance- ments in prober technology will now provide multiple solutions within the same package. Do your homework, and you may find that the science of electrical test is not as ominous as you thought. As a colleague of mine once said, "I can't even spell ET." We can find answers to black holes. Whether you are doing electrical test yourself or have a partner to turn-key it for you, I hope this bit of knowledge I've passed along helps in decision making and under- standing some of the science behind ET. ET is a much bigger process than what it used to be, so give those folks a chance when the delivery heat is on. It takes a little more time nowadays to "git 'er done!" PCB007 Todd Kolmodin is VP of quality for Gardien Services USA and an expert in electrical test and reliability issues. To read past columns or contact Kolmodin, click here. On November 5–7, 2019, in Minneapolis, Minnesota, the electronics manufacturing industry will get a chance to be part of the first conference focused on electronics ma- terials. Sponsored by IPC, the Electronics Materials Forum offers a platform to discuss the wide range of materials used to manufacture and assemble bare boards. This fo- rum approaches the issue of materials from two different directions—first, based on their function in the manufac- turing process, and second, to survey new electronics industry technologies and compile the required materials advances needed to make them possible. Historically, IPC has looked at materials from two differ- ent standpoints: first, the permanent materials for either board fabrication or assembly with their associated re- quirements and properties enumerated in IPC standards; and second, process (consumable) materials used to cre- ate some manufacturing step but are not a permanent part of the product board. IPC tends to give criteria for successful use of these process chemicals but gives the fabricator wide latitude in selection. At this time, proposals for presentations are still being accepted. The following are some key areas of interest for this conference: • Permanent board fabrication materials will be addressed in a session with paper topics including substrate materials, novel board laminates, surface finishes, and solder mask advancements • Permanent board assembly papers will concern new and novel solder alloys, thermal interface solutions, conformal coatings, adhesives, underfills, and new protective materials with properties such as water repellency • Process considerations include new materials for producing HDI or substrate-like bare circuits or in assembly, new fluxes, and cleaning chemistry materials • Assembly strategy papers may also be presented Separate technology sessions will address the required properties to be developed in materials to implement the following new technologies: 5G communications, sub- strate-like boards, printed electronics, flexible circuitry, and wearable circuits. These papers, with participation from OEM companies and trailblazers, will help shape the development of new materials for our industry. See you in Minneapolis for the Electronics Materials Forum! (Source: IPC) First Annual IPC Electronics Materials Forum