SMT007 Magazine

SMT-June2019

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26 SMT007 MAGAZINE I JUNE 2019 printing information with SPI measurement data. More advanced software automatically performs design of experiment (DOE) intended to complete a detailed SPI result analysis using advanced diagnostic algorithms and noise fil- tering models, and then recommends the ideal print parameters. Using advanced communication, the Koh Young AOI systems feed corrected mounting position values to mounters, which ensures the pick-and-place machines mount the com- ponents in the correct position. This feature improves process repeatability by automat- ically adjusting placements and identifying trends to make further positional corrections. Creating the Real-time Feedback Loop Connecting mounters and AOI provides obvi- ous benefits, but when integrated with APC, it can improve yields, especially in high-den- sity boards. To do this, mounters use the data received from inspection to update the place- ment program, ensuring the components are placed onto the solder deposits rather than onto the substrate pads. This approach to plac- ing components on the printed solder can increase production yields and reduce defects. Connecting inspection systems with mount- ers can help achieve complete line communi- cation and further enhance the value of the inspection process. For example, M2M con- nectivity optimizes the process by exchanging real-time measurement data between printers, SPI, mounters, and AOI systems. The systems feed offset and warning data to other systems while analyzing trends for process optimiza- tion and traceability. Combined, this process provides unsurpassed performance power. Communication between equipment will improve pro- cess repeatability by auto- matically adjusting compo- nent placement to the solder deposit rather than to the pad location. This advanced process further improves microchip mounting reliabil- ity. Figure 2 charts dramatic improvement across five dif- ferent defect types when a manufacturer uses advanced process control in production compared to a conventional placement approach with no communication between sys- tems. Networked intelligent systems that allow real-time Figure 2: Post-reflow defect reduction effects with adaptive process control.

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