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PCB007-June2019

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80 PCB007 MAGAZINE I JUNE 2019 1 EPTE Newsletter: Global Electronics Industry Continues to Decline E Sales from consumer electronics are expected to slip this year, continuing a decline that be- gan in December 2018. The Taiwanese PCB in- dustry was first to signal stormy days ahead, and data from the global semiconductor indus- try for the same month backed up this gloomy forecast. 2 Trouble in Your Tank: OSP Performance—Effect of Film Thickness and Microetch E Two often overlooked perfor- mance attributes for organic solderability preservatives (OSPs) are the organic film thickness and the topography of the copper after microetch. Film thickness up to an extent is critical. However, the copper topography and surface preparation also play a role. Thus, you should not overlook the critical nature of the overall OSP film thickness. Read on. 3 Super PCB's Jessica Zhang on LEDs and Other Trending Business Areas E In an interview with I-Con- nect007 at the recent West Penn SMTA Expo, Super PCB Program Manager Jessi- ca Zhang provides an over- view of the company and shares new business trends they're seeing, including LEDs, wearable de- vices, and more. 4 Creating Smart Surfaces with Electronic Functionality E Of all of the technical user presentations I attended at the AltiumLive design summit in Munich, the one I found most fascinating introduced an in- novative technology that en- couraged a bit of lateral think- ing and appealed to my creative side: the IMSE, or injection-moulded structural electronics. Editor Picks from PCB007 Michael Carano Jessica Zhang Pete Starkey

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