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60 PCB007 MAGAZINE I JUNE 2019 discrepant product that was processed at plat- ing during the same time. This ensured that products with low copper that could poten- tially lead to field failures were not shipped to the customer. Examples of copper voiding that were dispositioned using four-wire Kelvin test- ing are shown in Figures 7 and 8. Applications The main area where we observed benefits utilizing this process was dispositioning or- ders where there was fallout for voiding. We still completed failure analysis for corrective action and process improvement but utilized four-wire Kelvin testing to disposition the non- Figure 7: Copper voiding dispositioned by four-wire Kelvin testing. Figure 8: Copper voiding dispositioned by four-wire Kelvin testing. Figure 6: Resistance versus copper thickness.