Issue link: https://iconnect007.uberflip.com/i/1140547
JULY 2019 I DESIGN007 MAGAZINE 9 We also have columns from our regular con- tributors Barry Olney of iCD, Stephen Chavez with the IPC Designers Council, Bob Tise of Sunstone Circuits, consultant Tim Haag, and Phil Kinner of Electrolube. Further, we have a technical article by C.F. Yee of Keysight Tech- nologies, titled "The Impact of Inductance on the Impedance of Decoupling Capacitors." New Flex007 Section Yes, it's official. Take a quick check of our Table of Contents, and you'll notice that we now have a Flex007 section. So much of the content of the quarterly Flex007 Magazine re- volved around flex design that we've merged that publication with Design007 Magazine. Each month, you'll find cutting-edge flexible circuit design content in this new section of Design007 Magazine. Now, you won't have to wait three months to get the great flex techni- cal articles and information that you need to stay ahead of the game. Flex is one segment that just keeps growing, and we'll be here to provide the flex design information that you can't find anywhere else. See you next month! DESIGN007 Andy Shaughnessy is managing editor of Design007 Magazine. He has been covering PCB design for 19 years. He can be reached by clicking here. pect ratios as small as possible. Try to avoid mixing processes on the same board. Variation is the enemy. This is a problem that will likely require competitors to share data and work together for the greater good. As Magera said, "OEMs can't let their fabricators go out of business." Incidentally, the IPC V-TSL-MVIA subcommit- tee needs more members who can share their company's data on microvia failures and put in the hard work needed to solve this problem. Talk about working as a team. I believe our in- dustry will come together and work with each other on this problem, even if means a few un- comfortable moments of working with rivals. This month, we kick off with an article by Greg Ziraldo, director of operations at Ad- vanced Assembly. He explains how to design vias for maximum reliability, echoing the idea that, "When it comes to vias, bigger is better." Then, we have a feature interview with consul - tant and I-Connect007 columnist Dennis Fritz who discusses the difference between two terms that are often used interchangeably—"quality" and "reliability"—as well as a proposal to be - gin allowing the manufacture of DoD PCBs with lead-free solder. And we have a feature interview with Brook Sandy-Smith, IPC's tech - nical education program manager, who gives a review of the IPC High-Reliability Forum and Microvia Summit and some of the reliability is - sues that technologists are facing today. Past issues of Flex007 Magazine are available for download here.