PCB007 Magazine

PCB007-July2019

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108 PCB007 MAGAZINE I JULY 2019 Coming Soon to PCB007 Magazine: SEPTEMBER: Standards We report on recent developments in current and emerging standards and take a step back to discuss some of the inherent strengths and weaknesses of standards processes. AUGUST: Wet Processes Wet processes are the core of printed circuit fabrication. What's new? Are there new offerings down the road to make your wet process capabilities sharper? Faster? Greener? Easier to operate? Find out in this issue. Events Calendar Additional Event Calendars NEPCON South China 2019 E August 28–30, 2019 Shenzhen, China C3Bio Conference on Biosensors, Bioelectronics, and Biodevices E September 9–10, 2019 Bath, U.K. C3Bio Training Workshop on Lab-on-Chip E September 11–12, 2019 Bath, U.K. EIPC PCB Pavilion @ WNIE Exhibition E September 18–19, 2019 Warwickshire, U.K. productronica India 2019 E September 25–27, 2019 Delhi NCR, India electronica India 2019 E September 25–27, 2019 Delhi NCR, India 52 nd International Symposium on Microelectronics E September 29–October 3, 2019 Boston, Massachusetts, USA IPC Electronics Materials Forum E November 5–7, 2019 Minneapolis, Minnesota, USA productronica 2019 E November 12–15, 2019 Munich, Germany 2019 International Electronics Circuit Exhibition (Shenzhen) E December 4–6, 2019 Shenzhen, China

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