SMT007 Magazine

SMT007-Aug2019

Issue link: https://iconnect007.uberflip.com/i/1150604

Contents of this Issue

Navigation

Page 107 of 109

108 SMT007 MAGAZINE I AUGUST 2019 SMTA Ohio Expo & Tech Forum E August 8, 2019 Strongsville, Ohio, USA The 20 th International Conference on Electronic Packaging Technology E August 11–15, 2019 Hong Kong NEPCON South China 2019 E August 28–30, 2019 Shenzhen, China SMTA International 2019 E September 22–26, 2019 Rosemont, Illinois, USA productronica India 2019 E September 25–27, 2019 Delhi NCR, India electronica India 2019 E September 25–27, 2019 Delhi NCR, India 52 nd International Symposium on Microelectronics E September 29–October 3, 2019 Boston, Massachusetts, USA productronica 2019 E November 12–15, 2019 Munich, Germany Events Calendar Coming Soon to SMT007 Magazine: SEPTEMBER: Standards We report on recent developments in current and emerging standards and take a step back to discuss some of the inherent strengths and weaknesses of standards processes. OCTOBER: The Landscape of the Industry In this issue, we examine the current landscape of the electronics industry and how it is changing from design tools to AI, manufacturing, and markets. Additional Event Calendars

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Aug2019