SMT007 Magazine

SMT007-Aug2019

Issue link: http://iconnect007.uberflip.com/i/1150604

Contents of this Issue

Navigation

Page 38 of 109

Submit Your Abstract Today Technologies Involved: Additive PCB technologies Semi Additive Processing (SAP) Modified Semi Additive Processing (mSAP) Printed Technologies Flexible Hybrid Electronics (FHE) Advanced HDI technology - subtractive etch processing Design Software Assembly Raw Materials Chemistry Molded Interconnect Devices Laser technology Inspection Equipment Additive Electronics Conference: PCB Scale to IC Scale October 24 - 25, 2019 DoubleTree by Hilton San Jose San Jose, California, USA About the Conference From smartphones to implantable medical devices, electronic designers and fabricators are continuously challenged to miniaturize the size of their products. The SMTA Additive Electronics Conference brings together practitioners looking at the SMT-SEMI convergence. Targeted at substrates with line space/width down to 5um, this conference will showcase substrate design and manufacturing technologies that will enable the next generation of electronic products. Lenora Clark MacDermid Enthone Conference Chair Tara Dunn Omni PCB Conference Chair Conference Co-Chairs: www.smta.org/additive

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Aug2019