94 SMT007 MAGAZINE I AUGUST 2019
1
SMT Solver: Benchmarking Defect
Levels in Your Products
E
In this column, Ray Prasad dis-
cusses why zero defects may be
a desirable goal but not a real-
istic one. He also shares some
industry data as proof, which
you can also use to benchmark
defect levels in your products.
Finally, he also addresses the choices when
selecting components that have a big impact
on the level of defects you should expect.
2
Digitalization: Key to the Future of
Electronics Manufacturing?
E
Electronics manufacturers have
long relied on automation to
streamline their production pro
-
cesses. The concept of the smart
factory takes this one step fur-
ther with artificial intelligence
(AI), robotics,
analytics, big data, and the inter-
net of things (IoT) promising an even greater
level
of autonomy, agility, and connectivity.
3
Zulki's PCB Nuggets:
Three Die Attach Methods for
Microelectronics Manufacturing
E
Die attach technology is increas-
ingly being applied in PCB hybrid
manufacturing (i.e., combining
traditional SMT manufacturing
with microelectronics) to com
-
ply with the requirements of
small
PCBs, especially rigid, flex, and combi-
nation rigid-flex circuit boards. These smaller
boards
are used in a variety of IoT, wearable,
and portable applications.
4
Smart Manufacturing Roadmap:
Data Flow Considerations for the
Electronics Manufacturing Industry
E
The 2019 iNEMI Roadmap features a new chap-
ter on smart manufacturing. The chapter iden-
tifies key technology gaps and needs and offers
recommendations
to guide the electronics man-
ufacturing industry in realizing the benefits of
smart manufacturing. This article is based on
information excerpted
from the chapter.
Editor's Picks from SMT007.com
Ray Prasad
Neil Sharp
Zulki Khan
