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Design007-Aug2019

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AUGUST 2019 I DESIGN007 MAGAZINE 43 The PCB Norseman: From Wooden Huts to Homemade G0-karts—It All Srarts With Design! E Whether building the coolest go-kart or the most sophisticated electronic hardware, the story is the same: It starts with design. And for designers and manufacturers, early involve- ment and commitment between all the in- volved parties in a product development pro- cess diminish the risk for mistakes and misun- derstandings. Dissecting the IPC Regional Survey on PCB Technology Trends E Sharon Starr, Denny Fritz, and Mike Cara- no talk about the global 2018 IPC Technolo- gy Trends Report released early this year— the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and region- al insights, and the industry outlook over the next five to 10 years. An Examination of Glass-fiber and Epoxy Interface Degradation in PCBs E Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can devel- op a loss of electrical insulation resistance be- tween two biased conductors due to conduc- tive filament formation. Microvias: Links of Faith are Not Created Equally E Microvias connect adjacent copper layers to complete electrical paths. There are copper- filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article dis- cusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface. EPA, Industry Come Together in Visit to TTM Facility E IPC member TTM Technologies is proud to show off the new wastewater-treatment system at its Sterling, Virginia plant, which is helping to enhance the company's pollution preven- tion and resource recovery performance. Avoiding CAF Failures at the IPC High-reliability Forum E Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High- Reliability Forum and Microvia Summit in Bal- timore about his presentation on the causes of conductive anodic filament (CAF), the dan- gers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures. Global PCB Market Analysis and Outlook E The global PCB market is expected to reach an estimated $89.7 billion by 2024 with a CAGR of 4.3% from 2019 to 2024. It's Only Common Sense: It's Time for Summer Reading E Some people go to the beach excited about their summer reading. When Dan Beaulieu goes to the beach (yeah, right!), his summer reading involves much more useful, and for him, fun (believe it or not) business books on custom- er service, business strategy, and my personal favorites, advertising, and marketing. Here are some of the best!

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