Issue link: https://iconnect007.uberflip.com/i/1156271
6 PCB007 MAGAZINE I AUGUST 2019 SHORTS: Red Wine May Hold the Key to Wearable Electronics Mobile Performance Report Shows Incredible Speeds on 5G Compared to LTE New Filter Enhances Robot Vision on 6D Pose Estimation Cardiff Delivers Compound Semiconductor Breakthrough Cyborg-like Microchip Valve Driven by Earthworm Muscle 'Seeing' in Real Time DEPARTMENTS: Career Opportunities Events Calendar Advertiser Index & Masthead HIGHLIGHTS: MilAero007 EIN007 Industry News PCB007 Suppliers Top 10 from PCB007 ARTICLES: Innovative Electroplating Processes for IC Substrates by Saminda Dharmarathna, et al. SAP Utilizing Very Uniform Ultrathin Copper by Steve Iketani and Mike Vinson Vertical Conductive Structures, Part 3: Design Tool Techniques by Ed Hickey, Mike Catrambone, and Joan Tourné Solder Mask Curing: UV Bump Overview by Nikolaus Schubkegel COLUMNS: There's An Art to Plating by Nolan Johnson CFX and Hermes: The Plug-and-Play IPC Standards Building Momentum for Industry 4.0 by Dr. John Mitchell Via Hole Filling and Plugging, Part 1 by Michael Carano The Past 15 Years: Changes to MIL-PRF-31032 Certification, Part 1 by Mike Hill 56 76 90 100 8 16 40 72 9 39 43 55 69 103 107 118 119 34 70 88 104 AUGUST 2019 • ADDITIONAL CONTENT 56