SMT007 Magazine

SMT007-Sept2019

Issue link: https://iconnect007.uberflip.com/i/1161956

Contents of this Issue

Navigation

Page 56 of 117

SEPTEMBER 2019 I SMT007 MAGAZINE 57 be needed. The example of back-end packaging commonality I mentioned before also came out of our smart manufacturing efforts. Other areas where we currently have, or are developing, projects with linkages to stan- dards include optical interconnect cleanliness, connector reliability, new package technology qualification, and solder voiding. In electron- ics manufacturing, there is such a breadth of activities that I can't say one is more important or more focused than the other. Andy Shaughnessy: How big of a role do stan- dards play in your roadmaps? A lot of people think of iNEMI for the roadmaps, which would be a reflection of what the standards are at the time. Benowitz: My impression is the standards aren't influencing the roadmap in the beginning, but the output of the roadmap could identify the need for standards—or updates to standards— in some areas. As you said, the landscape is defined by standards and other elements, tech- nology capabilities, etc., which are inputs to the roadmap. The outputs of the roadmap would be the gaps to meet those technology needs, and/or, in this case, the landscape that includes standards. Shaughnessy: It seems that it's kind of a bi- directional thing. You come out with roadmaps that state, for example, that we'll see lines and spaces of two and two in 2024. That trig- gers the people at the appropriate community at IPC to ask, "How do we accomplish that?" Then, back-and-forth communication begins. Benowitz: That's true. What a great example. As you said, if the standards currently don't address that, then we need to do something. We might have enough information to update the standard, or we don't have enough infor- mation, and we need to support it, which would manifest as a project. Shaughnessy: Like Nolan, I associated iNEMI with standards. iNEMI doesn't, but you're working with the people who do. Benowitz: Yes. There are relationships there, but it's not like anyone calls each other every day and says, "Help. I need this." Action comes- from the members and naturally occurs as opposed to a strategic occurrence, but maybe that's something for us to consider. We don't have regular meetings with the standards organizations saying, "What are you work - ing on?" Like us, the standards organizations provide a framework. The standards them- selves are done by representatives of the industry. Shaughnessy: It's interesting that the standards are kind of a snapshot in time. Some people would say, "Well, they're kind of behind the times because we can do much more than this." But at least we know right now, with IPC standards, that you can build a product pretty much anywhere, theoretically, by following standards. With the iNEMI roadmaps, you're looking way down the road. Benowitz: That's a good point. Like our proj- ects, the ones we're working on represent a point in time. What comes in next is the next- gen stuff. Standards show a point in time, too, with some outward look, but as long as tech- nology changes, this will all evolve following some sort of natural drumbeat. Johnson: There is, and at the risk of overus- ing the word, an ecosystem of participation amongst the different organizations. Benowitz: That's a fair representation. There is Action comes from the members and naturally occurs as opposed to a strategic occurrence, but maybe that's something for us to consider.

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT007-Sept2019