Issue link: https://iconnect007.uberflip.com/i/1161956
SEPTEMBER 2019 I SMT007 MAGAZINE 79 modate a range of port inlet, port exhaust, and side-to-side cooling options. Cage-inte- grated heat sinks have been validated for per- formance, taking advantage of front-to-back air- flow for module cooling. Air can be drawn from the aisle across the heat sink for additional dis- sipation. In addition, an innovative transceiver heat sink is optional in the QSFP-DD specifica- tion. This innovation in thermal management is a big improvement compared to other module types that use integrated heat sinks, which pro- vide unneeded thermal management for passive copper cables and insufficient thermal manage- ment for WDM/coherent applications. Due to its thermal management features, the single QSFP-DD SMT connector and cage sup- port at least 12 W in its standard configuration; the heat dissipation designs required for higher- consumption classes are relaxed for the lower- power classes to avoid unnecessary cost. For thermal loads beyond 20 W, stack cages with internal riding heat sinks as well as single and belly-to-belly cages are available. The QSFP-DD system supports a module with eight host electrical lanes. It includes a mechan- ical module, a single-height 1x1 surface-mount cage and connector, and a press-fit 2x1 cage with integrated connector, thermal, pinout, and the CMIS management specification. In addition to its own interconnect standard, QSFP-DD CMIS can be applicable to Octal Small Form Factor Pluggable (OSFP) MSA and Con- sortium for On-Board Optics (COBO) as well as QSFP and SFP-DD. However, QSFP-DD inter- connects—due to their versatility, cost-effec- tiveness, and future-proofing—are engineered to be the dominant pluggable transceiver for the foreseeable future. As people continue to demand more from their connected devices—in more places and for more reasons than ever— the QSFP-DD system will be there to make the world a faster, more data-friendly place. SMT007 Scott Sommers is the director of industry standards, Molex, and co-chair of the QSFP-DD MSA. Development of Flexible Sensors Mimicking Human Finger Skin by DGIST Senior Researcher Changsoon Choi's team at the Department of Smart Textile Convergence Research at Daegu Gyeongbuk Institute of Science and Tech- nology (DGIST) and Dr. Sungwoo Chun at Sung- kyunkwan University (SKKU) have developed arti- ficial skin tactile sensors that can feel the similar pressure and vibration felt by human skin. Unlike existing sensors—which only have pres- sure and temperature detection functions—the new sensors detect both pressure and vibration as well as convert the surface roughness of a matter into electrical signals to identify with more sensitive and accurate detections of physical stimulations. The tactile sensors mimic both slow adaptive (SA) receptors that detect pressure and fast adap- tive (FA) receptors that detect the vibration and roughness. The sensors are in a flexible film-form that consists of an upper panel with human finger- print-like micro-patterns, a middle panel with vibra- tor sensor mimicking FA receptors, and a low panel with a pressure sensor mimicking SA receptors. The sensors open the potential of artificial skin grafting for patients who need skin graft as a result of acci- dents to have a real skin sensation. Choi said, "I was inspired to develop the new sen- sor while watching a movie where the main char- acter was wearing a suit to experience virtual real- ity and feel his pain like in real life. I hope that our research becomes the cornerstone for artificial skin-related and other researches." This research was published in Nano Letters. (Source: DGIST)