Design007 Magazine

Design007-Sept2019

Issue link: https://iconnect007.uberflip.com/i/1163814

Contents of this Issue

Navigation

Page 111 of 127

112 DESIGN007 MAGAZINE I SEPTEMBER 2019 1 Beyond Design: Stackup Planning, Part 5 E Barry Olney describes the traditional stackup structures that use a combination of signal and power/ground planes. But to achieve the next level in stackup design, one needs to not only consider the placement of signal and plane lay- ers in the stackup, but also visualize the elec- tromagnetic fields that propagate the signals through the substrate. 2 Bill Brooks on Teaching PCB Design at Palomar College E Bill Brooks of Nordson ASYMTEK recently spoke with the I-Connect007 edi- torial team about his histo- ry in design and his time as a PCB design instructor, the curriculum he developed and taught, and various techniques that might be enacted today to better educate the design- ers of tomorrow. 3 IPC High-reliability Forum and Microvia Summit Review, Part II E The Microvia Summit provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solu - tions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, iden - tify causes and cures, and be able to consistent- ly and confidently supply reliable products. 4 Development of Flexible Hybrid Electronics E This article will present a hybrid manufacturing pro- cess to manufacture FHE systems with a two-layer interconnect structure uti- lizing screen printing of sil- ver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semi- conductor chips to the printed substrates. Editor Picks from PCBDesign007 and Flex007 Bill Brooks

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Sept2019