SEPTEMBER 2019 I DESIGN007 MAGAZINE 113
5
Denny Fritz: The Difference Between
Quality and Reliability
E
Andy Shaughnessy speaks
with industry veteran Den-
ny Fritz about the relation-
ship between quality and re-
liability—two terms that are
unequal but often used in-
terchangeably. We also dis-
cuss the current state of lead-free solders in
the U.S. military and defense market as well as
the microvia reliability issues Denny focused
on at IPC's High-Reliability Forum and Micro-
via Summit.
6
The Impact of Inductance on
Impedance of Decoupling
Capacitors
E
This article discusses the im-
pact of interconnection induc-
tance on the impedance of the
decoupling capacitor, which
influences the power integrity
of the PCB. The investigation
is performed with 3DEM simulation by vary-
ing the trace length and height of stitching vias
that connect the decoupling capacitor across
the power rail and ground.
7
Connect the Dots: Five Best
Practices to Ensure
Manufacturability
E
When you send your design for manufactur-
ing, your partner does not know what type of
device the board will be part of nor the condi-
tions in which it will have to perform. Be sure
your board can tolerate thermal stress or sol-
der joints risk breaking and damaging compo-
nents.
8
Fresh PCB Concepts: Qualities of
Medically Applied PCBs
E
In this inaugural column
from NCAB Group, Alifiya
Arastu discusses details of
PCBs used in medical appli-
cations, highlighting some
of the differences in terms of
demands and how the design must be handled.
9
Focusing on Surface Sensitivity
for Reliability
E
Customer Applications Sci-
entist Elizabeth Kidd and
Sales Engineer Alex Bien,
both of BTG Labs, discuss
with Andy Shaughnessy
their presentation at the
IPC-High-Reliability Forum and Microvia Sum-
mit on the challenges of working with highly
sensitive surfaces, such as the risk of contami-
nation. They also talked about the various sur-
face characterization techniques that BTG Labs
uses to identify such contaminants.
J
IPC Reliability Forum Wrap-up
With Brook Sandy-Smith
E
At the IPC High-Reliability Fo-
rum and Microvia Summit, the
speakers and panelists focused
on a variety of topics, but one
issue that kept popping up
was the failure of some mi-
crovias on military and aerospace PCBs. Fortu-
nately, some smart technologists are focusing
on determining the cause of these via failures.
Andy Shaughnessy asked Brook Sandy-Smith,
IPC's technical education program manager,
for a quick wrap-up of this event.
PCBDesign007.com for the latest circuit design news and information.
Flex007.com focuses on the rapidly growing flexible and rigid-flex circuit market.
Alifiya Arastu
Denny Fritz
Chang Fei Yee
Elizabeth Kidd & Alex Bien
Brook Sandy-Smith
