PCB007 Magazine

PCB007-Oct2019

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40 PCB007 MAGAZINE I OCTOBER 2019 Summary Table 1 provides a com- parison of the InduBond electromagnetic induc- tance technology with conventional lamination technologies. Applications and Technology Potential This new way of pro- ducing the energy di- rectly into the materials to cure or polymerize the resins overcomes the limitations of conven- tional industrial ways of laminating materi- als. InduBond X-Press Technology shows great potential that can be ex- plored in four different areas: 1. More uniform, repeat- able, and controllable lamination of the standard multilayer materials (FR-4, poly- imide, CEM-3, etc.). The advantages in- clude high-quality, reliable, and repeat- able production; work flexibility; energy and investment savings; and a reduced floor surface. 2. Fast cycle lamination that could speed up prototyping with very short press cycle times. Advantages include high thermal increases (ΔT); high-productivity, high-quality, reliable, and repeatable production; work flexibility; energy and investment savings; and a reduced floor surface. 3. Advanced materials areas, such as high- temperature or high-pressure parameters. Advantages include high thermal increases (ΔT); high temperatures; high-productivity, high-quality, reliable, and repeatable production; work flexibil- ity; energy and investment savings; and a reduced floor surface. Table 1: Summary of the differences between standard heating methods and the electromagnetic inductance-based system.

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