PCB007 Magazine

PCB007-Nov2019

Issue link: https://iconnect007.uberflip.com/i/1185676

Contents of this Issue

Navigation

Page 38 of 113

X-PRESS Induction heating is the revolutionary new way of PCB lamination RFX High-precision (<10 microns) layer-to-layer registration 230N Next-generation inductive bonding machine MORE INFO MORE INFO MORE INFO +34 93 574 43 00 info@indubond.com www.indubond.com REVOLUTIONARY LAMINATING AND BONDING TECHNOLOGY

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Nov2019