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PCB007-Dec2019

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DECEMBER 2019 I PCB007 MAGAZINE 21 FMEA FMEA stands for failure mode effect analysis and is critical for problem-solving. An example of just one failure mode related to the use of an inner layer bonding process is shown in Table 1. Of course, there are multiple process steps to consider. For purposes of illustration, I only show issues related to a lack of uniformity of the coating appearance. Conclusion Certainly, there are additional skills I would recommend, including improving one's techni- cal writing skills. However, if you can acquire or improve on the skills we outlined here, you will achieve a much deeper understanding of critical aspects of the PCB fabrication process and ensure the end product is of the highest reliability. PCB007 Michael Carano is VP of technology and business development for RBP Chemical Technology. To read past columns or contact Carano, click here. Table 1: Failure mode example.

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